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金刚石线锯

Diamond wire saw

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Diamond wire saw

金刚石线锯

With the wide application of hard and brittle materials, in the processing of single crystal silicon, sapphire, quartz, GaN, GaAs and other materials, especially in the silicon slicing process, the multi-wire cutting method of consolidated abrasive grains is gradually adopted. The diamond wire production process uses a composite plating process in which metal ions (nickel ions) are co-deposited with diamond particles by electroplating. The product has the characteristics of strong cutting ability, good cutting surface quality, low unit consumption and low wire breakage rate, etc. It is widely used in cutting production of various models.

太阳能领域的单晶硅、多晶硅的切方、切片;LED领域的蓝宝石晶棒的切割;钕磁石等磁性材料,碳化硅、水晶、陶瓷等硬脆材料的切割。 Application areas of electroplated diamond wire: cutting and slicing of monocrystalline silicon and polycrystalline silicon in the field of solar energy; cutting of sapphire ingots in the field of LED; cutting of magnetic materials such as neodymium magnets, cutting of hard and brittle materials such as silicon carbide, crystal, ceramics, etc.



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