1. Solar energy field: slicing of single crystal silicon ingots or polycrystalline silicon ingots; slicing of silicon wafers.
2. LED field: sapphire crystal rod cube, slice.
3. Other fields: magnetic materials such as neodymium magnet or ferrite magnet; silicon carbide and other difficult-to-cut materials, various substrates; crystal slices; ceramic cutting.
Different from the previous mortar cutting technology, diamond wire saw cutting adopts multi-wire cutting technology. This technology has strong cutting ability and high efficiency; diamond wire saws have strict control of wire diameter size, small cutting loss on cutting materials, and high precision in cutting products; because no mortar is used, the working environment is clean and energy saving Environmentally friendly products.
Electroplated diamond wire saws have their unique advantages:
(1) Compared with the free abrasive wire saw, it has higher processing efficiency and lower energy consumption;
(2) Avoid complicated procedures such as mixing, granulating, sintering, welding (or injection molding) in the manufacturing process of sintered diamond tools;
(3) It can be used to process non-conductors that cannot be processed by MED;
(4) The diamond wire saw is wound around the drum, which can simultaneously cut multiple processed parts (such as silicon rods), and can simultaneously process multiple processed parts;
(5) Due to the gap between the beads of the sintered diamond wire saw, the gap may wear out prematurely and cause the wire (wire) to break [6'7]. The continuous distribution of diamond in the electroplated diamond wire saw can avoid the Premature fracture
(6) Compared with circular and band saws, wire saws can flexibly change the cutting direction and can be used to process complex geometries;
(7) Because the diameter of the wire saw is small (generally <1ram), the notch loss during processing is small, which is of great significance for the processing of expensive semiconductors and gems.
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